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PPD Lead-Free Solder Paste

$13.99$61.99

The solder paste with a melting point of 183 degrees is called low temperature lead-free solder paste, and its alloy composition is SnBi.

PPD-01PPD-02PPD-03PPD-04PPD-05PPD-06PPD-07PPD-08
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Description

 

PPD 138 – 183 ℃ lead free low temperature solder paste for CPU IC chip repair, PPD best melting point 138 – 183 ℃ lead-free low temperature solder paste for IC chip special tin planting.

The solder paste with a melting point of 183 ℃ is called low temperature lead-free solder paste, and its alloy composition is SnBi. When the components of the patch cannot withstand temperatures above 183 ℃ , the solder paste is welded with low temperature solder paste. To protect against high temperature.

 

PRODUCTS ARE WIDELY USED

 

 

Various Specifications

Moderate Viscosity, No Slump, No Drift

 

Features :

  • Excellent capacity of solder-stickiness
  • Excellent Anti-wet capacity
  • Widely used on BGA, PGA, CSP packages and flip chip operation
  • Suitable for multiple PCB reflow
  • No-clean and Lead free for environmental protection

 

It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.

 

Specifications

Model PPD-01 PPD-02 PPD-03 PPD-04 PPD-05 PPD-06 PPD-07 PPD-08
Quantity 1 Pcs 1 Pcs 1 Pcs 1 Pcs 6 Pcs 6 Pcs 6 Pcs 6 Pcs
Degress 138 ℃ 158 ℃ 183 ℃ 217 ℃ 138 ℃ 183 ℃ 217 ℃ 158 ℃

Additional information

Weight 0.4 kg

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