PPD 138 – 183 ℃ lead free low temperature solder paste for CPU IC chip repair, PPD best melting point 138 – 183 ℃ lead-free low temperature solder paste for IC chip special tin planting.
The solder paste with a melting point of 183 ℃ is called low temperature lead-free solder paste, and its alloy composition is SnBi. When the components of the patch cannot withstand temperatures above 183 ℃ , the solder paste is welded with low temperature solder paste. To protect against high temperature.
PRODUCTS ARE WIDELY USED
Moderate Viscosity, No Slump, No Drift
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
|Quantity||1 Pcs||1 Pcs||1 Pcs||1 Pcs||6 Pcs||6 Pcs||6 Pcs||6 Pcs|
|Degress||138 ℃||158 ℃||183 ℃||217 ℃||138 ℃||183 ℃||217 ℃||158 ℃|