KEK Original Solder Paste


Soldering paste can effectively help users improve production efficiency, product quality, and ensure a rational and diverse production process.




This is a new type of solder paste that replaces the traditional lubricating gel tape. Effectively avoids inconveniences during transportation, just as it is easy to fall off, the required preparatory work before use and the required cleaning after use etc.

Lead-free solder pastes are a high-quality product intended for structural and assembly soldering of electronic components, various materials, components and blocks of electronic equipment, microelectronics products in situations where environmental regulations (e.g. RoHS) prescribe the exclusion of toxic materials and compounds from the solder, in particular lead.



They are used for manual, automated or mechanized surface mounting of radio-electronic components, are made on the basis of weakly activated fluxes and solder microbeads made of ultrapure metals – tin, silver, copper.


Sn42Bi58:Lead-free low temperature solder paste,    melting point: 138°C LED type special non-high temperature resistant board is used, general products are not recommended.

Sn63:Leaded medium temperature solder paste,melting point: 183°C Suitable for basic PCB component maintenance, IC, SMD, more commonly used.

Sn62.8Pb36.8Ag0.4: Medium temperature silver-containing solder paste, melting point: 181°C Suitable for mobile phone tail plug, basic PCB component repair welding is recommended.

Sn64.7Bi35Ag0.3: Lead-free medium temperature environmental protection solder paste, melting point: 151°C. Suitable for lead-free products, soldering use with special requirements for reflow soldering, specific maintenance use.

Sn99Ag0.3Cu0.7: Lead-free environmentally friendly high temperature solder paste, melting point: 227°C. Suitable for SMT processor special process capable of withstanding high temperature.

Sn96.5Ag3.0Cu0.5: Lead-free environmentally friendly high temperature solder paste, melting point: 217°C



The alloy must be selected based on the type of production, the working conditions of the final product, the type of coating of the printed circuit board and the terminals of the components, the sensitivity of the components to temperature and soldering technology.The temperature profile used for soldering Sn62Pb36Ag2 is transferred 30 ° C up the temperature scale, while the maximum soldering temperature will be 235 ° C. Such an alloy requires the use of a special flux with extended activity, capable of operating at elevated temperatures.For the electronics industry, the most acceptable solder to replace the traditional alloys Sn63Pb37 and Sn62Pb36Ag2 is Sn95, 5Ag3, 8Cu0, 7, suitable for reflow soldering (i.e. in paste) and for wave soldering. The presence of copper prevents the formation of intermetallides.

Additional information

Weight0.1 kg


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